Intel Xeon 5160 / EY017AA / Interface components / HP

Intel Xeon 5160

€ 1,143.40

€ 1,360.65

Intel Xeon 5160 (4M Cache, 3.00 GHz, 1333 MHz FSB)

MPN: EY017AA

Stock: 0

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Specifications
General

Product information

Category	Interface components
Stock	0
MPN	EY017AA

Description

HP Intel Xeon 5160. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 65 nm. Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Weight: 2.05 kg, Processor package size: 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-xPerformance. Efficiency. Agility. Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing. The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors. The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology. Dual-core processing Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness. Intel® Core™ microarchitecture Better performance on multiple application types and user environments at a substantially reduce power envelope. Majority of SKUs at 65W Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs. Ultra-dense, ultra low-power SKUs at 40W Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density. 4 MB shared L2 cache Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency. Entire L2 cache can be allocated to one core. 1066 and 1333 MHz system bus Faster system bus speeds than previous generations for increased throughput. Intel® Virtualization Technology New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments. Intel® Extended Memory 64 Technology (Intel® EM64T) Flexibility for 64-bit and 32-bit applications and operating systems. Enhanced Intel® Speedstep™ Technology Helps reduce average system power consumption and potentially improves system acoustics.

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Processor
Processor socket	LGA 771 (Socket J)
Processor frequency	3 GHz
Processor base frequency	3 GHz
Processor cores	2
Processor family	Intel® Xeon® 5000 Sequence
Processor model	5160
Processor threads	2
Processor front side bus	1333 MHz
Processor operating modes	64-bit
Processor cache type	L2
Processor cache	4 MB
Processor lithography	65 nm
Compatible chipsets	Intel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5000Z, Intel® 5100, Intel® 5400
Component for	Server/workstation
CPU multiplier (bus/core ratio)	9
FSB Parity
Technical details
Execute Disable Bit
Enhanced Intel SpeedStep Technology
Idle States
Thermal Monitoring Technologies
Intel® Virtualization Technology (Intel® VT)	VT-x
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Package size	37.5 x 37.5
Intel Demand Based Switching
Source data-sheet	Icecat.biz
Features
Thermal Design Power (TDP)	80 W
Processor package size	37.5 mm
Embedded options available
Physical Address Extension (PAE)
Power
Thermal power	80 W
VID Voltage Range	1 - 1.5 V
Weight & dimensions
Weight	2.05 kg
Graphics
On-board graphics card
Operational conditions
Tcase	65 °C
Processor special features
Intel VT-x with Extended Page Tables (EPT)
Intel Virtualization Technology (VT-x)

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